Pack Expo 2018

Control Techniques USA at Pack Expo Trade Show 2018

Pack Expo 2018

OCT 14, 2018  - OCT 17, 2018

McCormick Place / Chicago, IL / USA

For end users and suppliers from around the world, the PACK EXPO name stands for a quality tradeshow experience and a wide range of processing and packaging innovations for every vertical market.

If you haven’t registered already, you may use our promo code: 41C45 during the registration process and the fees will be waived prior to your check out.

Pack Expo 2018 Schedule

Sunday, October 14           9:00 am – 5:00 pm
Monday, October 15           9:00 am – 5:00 pm
Tuesday, October 16          9:00 am – 5:00 pm
Wednesday, October 17     9:00 am – 3:00 pm

Find Control Techniques and KB Electronics at BOOTH N-4650.

Please invite everyone to stop by booth N-4650 and get a first look at our new Digitax HD servo drive solutions!

website: www.packexpo.com

Pack Expo 2018 Control Techniques Promo Code

Registration Requirements - Complimentary End User* registration is valid for online pre-registration only; not valid on-site. Expires October 13, 2018.

*Complimentary registration is intended for use by end-user, retailer and contract packager registrants.

Non-exhibiting suppliers and distributors are required to pay standard attendance fees. A non-exhibiting supplier is defined as anyone who sells packaging/processing/converting equipment and/or anyone who’s primary product is packaging containers or materials, supplies, automation, or other services. A distributor is defined as a professional who resells packaging/processing/converting equipment/supplies.

 

Packaging Applications

This is a collection of Packaging videos created from FLASH animations the demonstrate many familiar applications used in the packaging industry. These videos demonstrate in simple terms how these servo motion control applications work.

These packing videos include the following applications: Auger Filler, Case Erector, Gap Puller, Inline Bottle Filler, Package Sorter, Press Feeder, Progressive Die Cut, Semiconductor Wet Bench, Smart Belt, and Vertical Form Fill and Seal.

 


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